AlN / Si₃N₄ / ZTA / Al₂O₃ — tape-cast and dry-pressed, all in-house. Full specs published.

Cost-effective insulating substrate; versatile, fits thick-film circuits and general power packaging.

Ultra-high thermal conductivity, far beyond alumina — built for IGBT, laser and high-power cooling.

Injection-molded precision parts with locating holes and notches; stable tolerance, batch consistency.

Ultra-high strength and toughness — first choice for load-bearing, high-reliability EV power modules.

Formed from high-purity aluminum nitride powder by tape casting and sintered at high temperature in a nitrogen atmosphere — beige finish, surface roughness 0.2–0.4 μm. 230 W/m·K bulk conductivity together with ≥10¹⁴ Ω·cm resistivity lets IGBT, SiC and GaN power devices carry higher current density in smaller packages. CTE 3.4 × 10⁻⁶/K is close to silicon.
Key performance of all grades, compared side by side at a glance.
| Spec | Unit | AlN-170 | AlN-200 | AlN-230 | |
|---|---|---|---|---|---|
| Basic | |||||
| Appearance | — | — | 米黄 | 米黄 | 米黄 |
| Density | 排水法 | g/cm³ | ≥3.33 | ≥3.33 | ≥3.33 |
| Surface roughness | Ra | μm | 0.2 – 0.4 | 0.2 – 0.4 | 0.2 – 0.4 |
| Warpage | — | % | ≤0.2 | ≤0.2 | ≤0.2 |
| Thermal | |||||
| Thermal conductivity | 25 ℃ | W/m·K | ≥170 | ≥200 | ≥230 |
| CTE | 25 – 800 ℃ | 10⁻⁶/K | 3.4 | 3.4 | 3.4 |
| Specific heat | 25 ℃ | J/(kg·K) | 720 | 715 | 710 |
| Mechanical | |||||
| Flexural strength | 三点抗弯 | MPa | ≥380 | ≥380 | ≥380 |
| Vickers hardness | 载荷 4.9N | GPa | 11 | 11 | 11 |
| Fracture toughness | 压痕法 | MPa·m½ | 3.0 | 2.7 | 2.4 |
| Young's modulus | 拉伸法 | GPa | 320 | 320 | 320 |
| Electrical | |||||
| Dielectric constant | 1 MHz | — | 8.5 | 8.5 | 8.5 |
| Dielectric loss | 1 MHz | 10⁻⁴ | ≤2 | ≤2 | ≤2 |
| Volume resistivity | 25 ℃ | Ω·cm | ≥10¹⁴ | ≥10¹⁴ | ≥10¹⁴ |
| Breakdown voltage | DC | kV/mm | ≥15 | ≥15 | ≥15 |
| Spec | Unit | AL-96 | AL-99 | |
|---|---|---|---|---|
| Basic | ||||
| Appearance | — | — | 白色 | 白色 |
| Density | 排水法 | g/cm³ | ≥3.70 | ≥3.70 |
| Surface roughness | Ra | μm | 0.2 – 0.6 | 0.1 – 0.3 |
| Warpage | — | % | ≤0.3 | ≤0.3 |
| Thermal | ||||
| Thermal conductivity | 25 ℃ | W/m·K | ≥20 | 29 |
| CTE | 25 – 800 ℃ | 10⁻⁶/K | 7.8 | 7.8 |
| Specific heat | 25 ℃ | J/(kg·K) | 750 | 750 |
| Mechanical | ||||
| Flexural strength | 三点抗弯 | MPa | ≥350 | ≥450 |
| Vickers hardness | 载荷 4.9N | GPa | 14 | 14 |
| Fracture toughness | 压痕法 | MPa·m½ | 3.0 | 3.0 |
| Young's modulus | 拉伸法 | GPa | 340 | 340 |
| Electrical | ||||
| Dielectric constant | 1 MHz | — | 9.4 | 9.7 – 10.5 |
| Dielectric loss | 1 MHz | 10⁻⁴ | ≤3 | < 1 |
| Volume resistivity | 25 ℃ | Ω·cm | ≥10¹⁴ | ≥10¹⁴ |
| Breakdown voltage | DC | kV/mm | ≥15 | ≥15 |
| Spec | Unit | SN-80 | |
|---|---|---|---|
| Basic | |||
| Appearance | — | — | 灰色 |
| Density | 排水法 | g/cm³ | ≥3.23 |
| Surface roughness | Ra | μm | 0.3 – 0.4 |
| Warpage | — | % | ≤0.2 |
| Thermal | |||
| Thermal conductivity | 25 ℃ | W/m·K | ≥80 |
| CTE | 25 – 800 ℃ | 10⁻⁶/K | 2.7 |
| Specific heat | 25 ℃ | J/(kg·K) | 710 |
| Mechanical | |||
| Flexural strength | 三点抗弯 | MPa | ≥800 |
| Vickers hardness | 载荷 4.9N | GPa | 15 |
| Fracture toughness | 压痕法 | MPa·m½ | 6.5 |
| Young's modulus | 拉伸法 | GPa | 310 |
| Electrical | |||
| Dielectric constant | 1 MHz | — | 8 |
| Dielectric loss | 1 MHz | 10⁻⁴ | ≤2 |
| Volume resistivity | 25 ℃ | Ω·cm | ≥10¹⁴ |
| Breakdown voltage | DC | kV/mm | ≥15 |
Send drawings or specs; samples in 5 working days, small batch in 30.